Workshop on High-Density Plasma for Advanced Semiconductor Packaging

Workshop on High-Density Plasma for Advanced Semiconductor Packaging

The Fraunhofer Innovation Platform at Feng Chia University (FIP-SPE@FCU) is pleased to host the Workshop on High-Density Plasma for Advanced Semiconductor Packaging on Thursday, October 30, 2025.

This workshop brings together experts from Germany’s Fraunhofer Institutes and Taiwan’s academia and industry to explore the applications and advancements of high-density plasma in advanced semiconductor manufacturing. Topics will include the principles of high-density plasma generation, etching and coating technologies, surface modification of materials, and real-world application cases. Participants will gain insights into the latest technological trends and research directions.

• Date: Thursday, October 30, 2025
• Time: 13:30 – 17:20
• Venue: 9th International Conference Hall, Feng Chia University (Xuesi 219)
• Organizer: Fraunhofer Innovation Platform at Feng Chia University (FIP-SPE@FCU)
• Fee: Free of charge. Online registration required.
• Registration Link: https://forms.gle/j3UXdagjkeqiTgJp6
• Contact: Ms. Tseng at +886-4-2451-7250 ext. 5012
  
  We warmly invite students, researchers, and professionals interested in high-density plasma technology, advanced packaging processes, and surface engineering to join us for this exciting opportunity to exchange ideas and explore cutting-edge developments!